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HPD Series

Flexible packaging laser cutting systems: HPD Series

Flexible packaging laser cutting systems need to perform reliably at production speed while preserving the integrity of the film. The HPD Series uses high-power CO2 laser technology for controlled pre-cutting, scoring, microperforation and coding on suitable flexible packaging materials.

One laser system for flexible packaging conversion

Flexible packaging laser cutting systems from Macsa id help manufacturers process films accurately during production. The HPD Series combines high-power CO2 laser technology with the flexibility to cut, score, perforate and code suitable flexible packaging materials in line.

By combining these processes in one system, HPD can support packaging designs that require easy-open features, controlled perforation patterns, windows, shaped cuts or variable coding. Each application is assessed according to the film structure, production speed, required result and line configuration.

Flexible packaging processes with HPD

Laser pre-cutting and shape cutting

Create pre-cuts, contour cuts, opening features and selected packaging shapes directly in the film. Digital laser processing allows changes to the cut design without replacing mechanical dies or blades.

Laser scoring

Laser scoring selectively removes part of the packaging structure to create an easy-tear feature while preserving the required barrier layers where the pack construction allows it. The final result should always be validated against the film and packaging application.

Laser microperforation

Create controlled perforation patterns in flexible films for applications such as fresh produce packaging or venting features. Perforation size, density and placement should be tested to meet the required pack performance.

In-line laser coding

Suitable HPD configurations can combine cutting and coding in the same laser system. Add batch information, dates, codes or graphics directly to the flexible packaging material as part of the production process.

Why choose HPD Series?

High-power CO2 laser processing

HPD Series lasers are designed for demanding flexible packaging applications requiring cutting, drilling, scoring and high-definition coding.

Non-contact processing

Laser processing operates without physical contact with the film, helping to avoid the wear associated with mechanical cutting tools.

Flexible packaging design

Change cut paths, scoring lines and perforation patterns digitally to adapt packaging formats without producing new mechanical tooling.

Multiple processes in one system

Combine cutting, scoring, microperforation and coding in one in-line laser solution, where the application and production layout allow it.

Integration for packaging lines

HPD Series systems can be specified for integration with flexible packaging and converting equipment, including flow-pack, form-fill-seal, stickpack, pouch-converting and sleeve applications.

No inks or cutting consumables

Laser coding does not require inks or solvents, while laser cutting avoids the use of blades and dies for the processing step.

Suitable materials and applications

HPD Series systems are used with suitable flexible films, foils and multilayer packaging structures. Applications can include PP, OPP, PET and PE films, subject to material testing and the required cut, score or perforation result.

The right laser configuration depends on:

  • Film composition and thickness.
  • Printed, coated or laminated layers.
  • Web speed and line layout.
  • Required cut, score or perforation pattern.
  • Packaging format and intended use.
  • Variable coding requirements.

Built for packaging-line integration

HPD Series systems can be integrated into new or existing flexible packaging lines. Our specialists assess the web path, available installation space, process timing, safety requirements and desired packaging result before recommending a configuration.

From pre-cutting and easy-open scoring to microperforation and in-line coding, Macsa id can help you define a laser process that fits your packaging operation.

HPD Series CO2 laser system for flexible packaging film cutting
Laser microperforation on flexible packaging film
High-power-density laser headDesigned for scoring applications and difficult-to-process substrates, with beam expansion used to improve definition.
Contact-free laser cuttingCreates cuts without blades, dies or punches touching the packaging material.
Easy-open laser scoringProduces controlled opening lines on validated flexible-packaging structures.
Controlled micro-perforationCreates consistent perforation patterns for packaging applications requiring managed ventilation or gas exchange.
Cutting, coding and scoring in one systemCombines functional packaging features with laser codes, dates, lots and variable information.

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